HR 6058
STRIDE Act
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Bill overview
The Semiconductor Technology Resilience, Integrity, and Defense Enhancement Act (STRIDE Act) aims to strengthen the global semiconductor supply chain and counter potential threats from the Chinese Communist Party. It directs the State Department to coordinate with allied nations to align export control policies, expand restrictions on technology transfers, and promote secure supply chains. The bill also establishes mechanisms for assessing and addressing countries’ cooperation in preventing semiconductor technology transfer to countries of concern, including utilizing the Foreign Direct Product Rule.
Key provisions
- Directs the Secretary of State to coordinate with allied nations on semiconductor technology export controls.
- Expands restrictions on semiconductor design tools, intellectual property transfers, and equipment servicing.
- Establishes a process for assessing and addressing countries’ cooperation in preventing technology transfer.
- Requires the application of the Foreign Direct Product Rule to semiconductor technology produced in non-cooperating countries.
- Mandates regular reporting to Congress on diplomatic engagement and progress toward coordination objectives.
- Defines key terms related to semiconductor technology and export controls.
- Authorizes the Export Advisory Review Board to develop plans to address inadequate cooperation.
- Provides for enhanced monitoring and enforcement of semiconductor technology controls.
Who is affected
- United States Government
Sponsors
Official sponsors from legislative records.
Primary sponsor
Cosponsors
James C. [R-GU-At Large] Moylan
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119th CONGRESS — 1st Session
H. R. 6058
IN THE HOUSE OF REPRESENTATIVES
A BILL
To provide for multilateral semiconductor technology supply chain coordination, and for other purposes.
This Act may be cited as the Semiconductor Technology Resilience, Integrity, and Defense Enhancement Act STRIDE Act
or the
.
It is the sense of Congress that—
the global semiconductor technology supply chain is critical to United States and allied national security, economic competitiveness, and technological leadership;
the Chinese Communist Party is pursuing strategies to dominate the semiconductor technology industry to assist in its military modernization efforts and human rights abuses through non-market practices, export control violation and avoidance, economic espionage, military-civil fusion, and predatory investment;
the integrity of the global semiconductor technology supply chain requires coordinated action with allied and partner nations to prevent technological capture by the Chinese Communist Party and other foreign adversaries;
unilateral export controls for protecting critical semiconductor technologies can be amplified with multilateral coordination; and
fully utilizing certain unilateral United States export control authorities, including the Foreign Direct Product Rule, has proven effective at preventing circumvention or avoidance of United States export controls through third-country production.
It is the policy of the United States to—
prevent adversarial capture of key chokepoints in the global semiconductor technology supply chain;
coordinate with allied and partner nations to expand and enhance semiconductor technology protection;
promote resilient, secure, and trusted semiconductor supply chains among United States allies and partners.
In carrying out subsection (a), the Secretary of State shall seek to achieve—
alignment of export control policies regarding semiconductor technology manufacturing equipment, including lithography systems, deposition equipment, etching tools, thermocompression bonding equipment, resist processing tools, chemical mechanical planarization tools, cleaning tools, handling tools, assembly, packaging, and test tools, and inspection systems and the critical subcomponents needed to produce such equipment;
expanded restrictions on semiconductor technology design tools, intellectual property transfers, equipment servicing, and technical assistance that could enable indigenous semiconductor technology development capabilities in countries of concern;
harmonized approaches to controlling dual-use semiconductor technology materials, including photoresists, specialty gases, and advanced substrates;
joint monitoring, enforcement, and administration mechanisms to prevent circumvention of semiconductor technology controls through third-country entities as well as prevent foreign backfilling of restricted items;
information sharing regarding semiconductor technology transfer risks, end-user verification, and supply chain security threats; and
establishment of trusted supplier networks for critical semiconductor technology components and manufacturing services.
The Secretary of State, in consultation with the Secretary of Commerce, shall regularly assess the extent to which countries engaged pursuant to subsection (a) are implementing measures consistent with United States policy described in section 3.
If the Secretary of State determines that a country engaged with pursuant to subsection (a) is not implementing security measures sufficient to fully prevent semiconductor technology transfer to countries of concern, the Secretary shall—
provide a detailed explanation of the specific deficiencies in the country’s semiconductor technology protection measures;
request the Secretary of Commerce to convene a meeting of the Export Advisory Review Board to identify and execute a plan of action to address the insufficient security measures within 21 days of the Secretary of State’s determination of inadequate cooperation; and
notify the appropriate congressional committees of such determination not later than 30 days after making such determination and provide routine updates on the Export Advisory Review Board meeting request and plan of action described in subparagraph (B).
In carrying out the process described in paragraph (2)(B), the Secretary of State shall provide to Export Advisory Review Board—
recommendations for the application of Foreign Direct Product Rule restrictions to semiconductor technology produced in the non-cooperating country that incorporate United States-origin technology, software, or equipment;
recommended entities for the expansion of Entity List designations for semiconductor technology supply chain companies or research institutions in the non-cooperating country that pose technology transfer risks; and
guidance on what additional steps may be needed to prevent foreign backfilling of U.S. technology in restricted sectors or entities in countries of concern.
Not later than 90 days after the date of enactment of this Act, and every 90 days thereafter, the Secretary of State shall submit to the appropriate congressional committees a report on—
the status of diplomatic engagement with key semiconductor technology-producing countries;
progress toward achieving the coordination objectives specified in subsection (b);
any determinations of inadequate cooperation made under subsection (c); and
the effectiveness of multilateral coordination in preventing semiconductor technology transfer to countries of concern.
The report required by this subsection shall be submitted in unclassified form but may include a classified annex.
In this section:
The term appropriate congressional committees means—
the Committee on Foreign Affairs of the House of Representatives; and
the Committee on Foreign Relations and the Committee on Banking, Housing, and Urban Affairs of the Senate.
The term countries of concern has the meaning given the term covered nation in section 4872(f) of title 10, United States Code.
The term Foreign Direct Product Rule means the rule exercising United States export controls on an item produced in a foreign country for shipment or transmission to another foreign country or foreign person, if the item—
is produced using technology or software that is otherwise subject to the jurisdiction of the United States;
is produced with the use of a plant or major component of a plant that—
is located outside the United States; and
has been created using the technology or software described in subparagraph (A); or
contains, is commingled with, is bundled with, is drawn from, or is produced by an item described in subparagraph (A) or (B).
The term semiconductor technology includes—
integrated circuits, microprocessors, and memory devices;
semiconductor design software and intellectual property;
semiconductor materials and specialty chemicals;
testing, assembly, and packaging equipment; and
any technology, component, or service that is essential to semiconductor design, manufacturing, or testing processes.